Our Core Technologies


Accelerating the customer’s
product development with
our packaging technologies

Miniaturization, high heat dissipation, high heat resistance, and high voltage resistance are among the requirements that customers stipulate for semiconductor packages. And NJR is able to satisfy these demands reliably with different package manufacturing technologies as well as flexible and free package design.

Packaging interfaces from micrometers to millimeters

A typical semiconductor device consists of a small, thin silicon chip encapsulated in a package of synthetic resin or ceramic material. The package plays a vital role in protecting the delicate silicon chip inside from impact, moisture, and dust. But it is important in other ways, too. A key role of the package is to facilitate attachment of the chip to the customer’s system. The packaging of the interfaces to the scale measured in millimeters makes the circuit inside, of the order of a few micrometers easy to handle
It is only when a semiconductor device is incorporated into the customer’s electronic circuit that its functionality can be demonstrated. NJR offers a wide lineup of packages that vary in material and size, featuring terminals of differing shape/direction, different mounting methods, different heat dissipation properties, etc. Customers can thus select the optimum combination for the proposed application.

Customization to meet the customer’s needs

At NJR we are dedicated to customizing packages to satisfy customer needs. And for this we take advantage of a range of manufacturing technologies.
One example is provided by the die-bonding process used to fasten a chip inside its package. For this, we can use various pastes: an insulating paste for good insulation, a soldering paste for excellent heat dissipation, or a metal nanoparticle paste that provides heat dissipation sufficient to survive at temperatures over 200°C. These different pastes enable us to manufacture the optimum package for your needs.
Additionally, various types of resin are available for covering the surface of the package. Some offer high adhesion or high pressure resistance, while others provide high heat dissipation.
Off-the-shelf packages are not the answer to the varied needs of our customers. Our priority is to provide a package with the optimum functionality and characteristics to match the customer’s circuitry. And this is why NJR’s packages have garnered such high praise from many set makers.

Increasing the efficiency of package production lines

We continually assess our package manufacturing lines and strive to improve productivity. One example of this approach is the adoption of a MAP (Mold Array Package) line for our common-platform line and a lead frame common-width line.
On the MAP line, a leadless package line, blocks of resin-encapsulated products mounted on various substrates (lead frame, organic, ceramic) are diced into individual pieces and all appropriate characteristics are evaluated with a prober. The platform following dicing is the common line. There is thus no longer any need for refilling trays. Moreover, thanks to the multiple simultaneous measurements made possible by prober inspection, we have achieved improvements in contact accuracy, yield, and throughput.
As the name suggests, our lead frame common-width line is for all products with the same width. On this line, the same equipment can thus operate on different products, which lowers investment costs and improves productivity.
Enhanced efficiency and rationalization allow us to produce a wide range of semiconductor packages for our customers in a shorter time and at reasonable cost.

Working with our customers to develop
package technologies optimized for automotive applications

As a semiconductor manufacturer, NJR’s mission is to provide our customers with solutions to issues involving electronic circuits. And to accomplish this, we actively develop packages in close collaboration with our customers.
The latest example of such a solution is a leadless package – the PMAP (Power Mold Array Package) – for automotive ICs. We have developed this in cooperation with our customers.
There are special requirements for automotive applications. To ensure high mounting reliability, a large lead-insertion type is often employed for its resistance to temperature change and vibration. This has meant that packages with a small mounting area, such as the leadless type, have not been widely used. However, PMAP has changed all that.
PMAP is a leadless type package with approximately 40% of the mounting area of a conventional lead-insertion type, yet it provides the same mounting reliability. Thanks to the use of a special structure to form the same solder fillet as that of the lead-insertion type, PMAP has excellent heat dissipation characteristics to withstand abrupt temperature changes inside the engine and sufficient strength to survive the intense vibration experienced during operation. Another similarity with the lead-insertion type is that PMAP enables the checking of solder fillet bonding after mounting. This contributes greatly to improved product reliability.
Power semiconductors are attracting more attention in the automotive and other fields, but PMAP can satisfy a wide range of customer requirements thanks to its package miniaturization and improved mounting reliability.
By striving to meet customer needs, NJR has developed sophisticated package technologies that have applications farther afield. Our pioneering spirit will ensure that this evolution will continue.

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