Ordering Information

1.1 Bipolar / 1.2 POWER SOURCE IC / 1.3 78LR

1.4 C-MOS / 1.5 QUARTZ CRYSTAL OSCILLATOR ICs / 1.6 LCD CONTROLLER DRIVER

1.7 C-MOS,and Bip Others / 2.GaAs IC / 3.OPTOELECTRONIC DEVICE

4.IC Package Code Table

The Codes are names defined in NJR.

Code Package Name Note
C-x Chip "x": Thickness of Chip (One-Capital Alphabet)
Blank:400µm, G:675µm, Z:625µm, C:260µm, D:200µm, L:140µm, V:130µm
CL Bumped Chip (Bump Height: 15µm)
CJ Bumped Chip (Bump Height: 17.5µm)
CH Bumped Chip (Bump Height: 25µm)
CU Bumped Chip (Bump Height: 45µm)
CT Chip (with Spread Tape)
Dx DIP "x": Mold Size (Blank or One-Digit Number)
DL TO-252(Forming Type, JEITA Type)
DLx TO-252(Forming Type, JEDEC Type) "x": Lead Pitch or Material (Paste etc.) (Blank or One-Digit Number)
Ex SOP JEDEC 150 mil/ JEDEC 300 mil "x": Mold Size (Blank or One-Digit Number)
F TO-220F
FL TO-220F Forming Type
Fx SOT-23, SC-88A, SC-82AB "x": Lead Width (Blank or One-Digit Number)
FΔx QFP, LQFP, PLCC "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Length or Lead Pitch or Material (One-Digit Number)
GΔx SOP, HSOP "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch or Material (Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "G"
HΔx TAB "Δ": Circuit Pattern or Material (Two-Digit Number)
USB "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number or One-Capital Alphabet)
JΔx BCC, QFL "Δ": Package Type (One-Digit Number or One-Capital Alphabet)
"x": Package Specification (One-Digit Number)
KΔx FLP, DFN (SON, ESON), QFN "Δ": Mold Size (One-Digit Number or One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number)
1: 0.5mm Pitch
2: 0.65mm Pitch
3: 0.95mm Pitch
4: 0.4mm Pitch
L SDIP Lead Pitch 1.778mm
SIP8
LΔx LCSP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch and Terminal Shape (One-Digit Number or One-Capital Alphabet)
Mx DMP, SDMP "x": Material (Blank or One-Digit Number)
MΔx EQFN "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
NΔx EPCSP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
PΔx FFP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number)
RΔx MSOP (VSP, TVSP) "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch(Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "R"
SΔx
or
S□Δx
PCSP "□": Vendor Code
"Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch and Terminal Shape (One-digit Number or One-Capital Alphabet)
Blank TO-220F-3
TΔx
or
TLΔx
TO-220 "L": Forming Type
"Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (Blank or One-Digit Number)
Ux SOT-89 "x": Lead Pitch or Material (Paste etc.) (Blank or One-Digit Number)
UΔx EPFFP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
VΔx SSOP, TSSOP "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch or Material (Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "V"
W-x Wafer "x": Thickness of Wafer(One-Capital Alphabet)
C:260µm
J:260µm (BG Finishing Stone: #2000)
D:200µm
H:200µm (BG Finishing Stone: #2000)
L:140µm (BG Finishing Stone: #2000)
V:130µm (BG Finishing Stone: #2000)
The finishing stones are not specified in C,D
WH Wafer (with Bump)
WS-x Scribed Wafer "x": Thickness of Wafer (One-Capital Alphabet)
WBΔx Scribed Wafer (with Bump) "Δ": Vendor Code and Material of bump (One-Capital Alphabet)
"x": Bump specification and Thickness of Wafer (One-Digit Number or One-Capital Alphabet)
WLΔx Bump Chip (Taping) "Δ": Vendor Code and Material of bump (One-Capital Alphabet)
"x": Bump specification and Thickness of Chip(One-Digit Number or One-Capital Alphabet)
TOP