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Reliability Test Specifications

We apply the reliability tests to new products, modified products (design, production equipment, process and materials) and reliability monitor test. Reliability tests verify that our products attain the reliability target.

1.Bipolar IC
IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package
TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
Pressure Cooker(PCT) - 121°C, 2.03×105Pa, 100%, 100h 22
Soldering Heat 1 301 Reflow,Max260°C, 10s
Precondition:125°C 16h, 85°C 85% 168h
22
Soldering Heat 2 301 260°C, 10s
Precondition:125°C 16h, 85°C 85% 168h
22
Thermal Shock 307 0°C 5min to 100°C 5min,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu, 245°C, 5s, with flux 11

IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 1 301 Reflow Max260°C ,10s
Precondition:125°C 16h ,85°C 65% 168h
22
Soldering Heat 2 301 260°C ,10s
Precondition:125°C 16h ,85°C 65% 168h
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Absolute Maximum Rating ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 302 260°C ,10s
,The dipping depth should be up to 1mm from the body
of the specimen.
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
2.CMOS IC,Bi-CMOS IC
IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package
TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 1 301 Reflow ,Max260°C ,10s
Precondition:125°C 16h ,85°C 85% 168h
22
Soldering Heat 2 301 260°C, 10s
Precondition:125°C 16h, 85°C 85% 168h
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Voprmax ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 1 301 Reflow Max260°C ,10s
Precondition:125°C 16h ,85°C 65% 168h
22
Soldering Heat 2 301 260°C ,10s
Precondition:125°C 16h ,85°C 65% 168h
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

IC Storage Conditions for Deaeration Packing(Dry Pack2:MSL3)/SMD Type Package

TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 1 301 Reflow ,Max260°C ,10s
Precondition:125°C 16h, 85°C 30% 168h
,30°C 70% 168h ,30°C 70% 72h
22
Soldering Heat 2 301 Max260°C ,10s
Precondition:125°C 16h, 85°C 30% 168h
,30°C 70% 168h ,30°C 70% 72h
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
Soldering Heat 302 260°C ,10s
,The dipping depth should be up to 1mm
from the body of the specimen.
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
3.GaAs IC
IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package
TEST Test Method
EIAJ ED-4701
CONDITIONS SAMPLE
SIZE
High Temperature Storage 201 Tstgmax ,1000h 22
Low Temperature Storage 202 Tstgmin ,1000h 22
Humidity 103 85°C ,85% ,1000h 22
Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Absolute Maximum Rating ,1000h 22
Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,40h 22
Soldering Heat 1 301 Reflow ,Max260°C ,10s
Precondition:125°C 16h, 85°C 85% 168h
22
Soldering Heat 2 301 260°C ,10s
Precondition:125°C 16h, 85°C 85% 168h
22
Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
4.Opt Device

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