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Ordering Information

New JRC ICs are named by New JRC Naming Standard. Please order our ICs by their full names.

New JRC Naming Standard
1.SILICON IC
1.1 Bipolar: standard
Example: NJM 4558 M - A (TE1)
  1 2 3   4 5
Item 1 Classification of items NJM----Bipolar monolithic ICNJW----Bi-CMOS IC Item 2 Part Number

The name of product is shown by three-digit, four-digit or five-digit number.
In case of substantial modification of circuit or masks, one capital alphabet is added to the name.

Example: NJM2233 → NJM2233B Item 3 Classification of Package(Refer to the 4.IC Package Code Table)
Item 4 Characteristics Selection and Screening Option

Specially selected product or specially screened product are shown by within two capital alphabets after a hyphen.

Item 5 Taping Form
Symbol Packing Note
TE x Emboss carrier tape The taping form is shown by two or three-digit alphanumeric character in parentheses
1.2 POWER SOURCE IC(fixed output voltage type)
<78/79 Series>
Example: NJM 78M 05 FA B (TE1)
  1 2 3 4   5 6
Item 1 Classification of items NJM----Bipolar monolithic IC Item 2 Part Number

The name of product is shown by two-digit number and one capital alphabet.

Item 3 Output Voltage

The output voltage is shown by two-digit number.

Item 4 Classification of Package (Refer to the 4.IC Package Code Table)
  • NJM78L/79L only
    • Output Voltage Accuracy
    • The output voltage accuracy is shown by one capital alphabet after package type mark.
Item 5 Characteristics Selection

Specially selected product is shown by within two-digit capital alphabet after a hyphen.

Item 6 Taping Form

The taping form is shown by two or three-digit alphanumeric character in parentheses.

1.3 78LR(Series Regulator with Reset Function) Series
Example: NJM 78LR 05 B M B (TE1)
  1 2 3 4 5   6 7
Item 1 Classification of items NJM----Bipolar monolithic IC Item 2 Part Number

Series Regulator with Reset Function is shown by "78LR".

Item 3 Output Voltage

The output voltage is shown by two-digit number.

Item 4 Reset Threshold Voltage

The reset threshold voltage is shown by one capital alphabet.

Item 5 Classification of Package(Refer to the 4. IC Package Code Table)

Output Voltage Accuracy
The output voltage accuracy is shown by one capital alphabet after package type mark.

Item 6 Characteristics Selection Option

Specially selected product is shown by within two-digit capital alphabet after a hyphen.

Item 7 Taping form

The taping form is shown by two or three-digit alphanumeric character in parentheses.

1.4 C-MOS: standard
Example1: NJU 6408B FG1 00
  1 2 3   4
Example:2 NJU 6391A E (TE1)
  1 2 3 5
Item 1 Classification of items NJU----C-MOS IC ,NJW----Bi-C MOS IC Item 2 Part Number

The name of product is shown by three-digit, four-digit or five-digit number and one capital alphabet (series product only).

Example: NJU6391A/91B/91C

In case of substantial modification of circuit or masks, one capital alphabet is added to the name.

Example: NJU6408 →NJU6408B Item 3 Classification of Package (Refer to the 4. IC Package Code Table)
Item 4 ROM Code and Screening Option

Screening Product: Screening level is shown by one capital alphabet after a hyphen.
LCD Controller Driver: ROM code is shown by two-digit alphanumeric character after a hyphen.
VFD Controller Driver: ROM code is shown by two-digit alphanumeric character after a hyphen.

Item 5 Taping Form
Symbol Packing Note
TE x Emboss carrier tape The taping form is shown by two or three-digit alphanumeric character in parentheses
1.5 QUARTZ CRYSTAL OSCILLATOR ICs
Example1: NJU 6395A E (TE1)
  1 2 3 4
Example2: NJU 6374Q CT
  1 2 3
Example3: NJU 6369B C-D
  1 2 3
Item 1 Classification of items NJU----C-MOS IC Item 2 Part Number

The name of product is shown by three-digit, four-digit or five-digit number and one capital alphabet (series product only).

Example: NJU6391A/91B/91C Item 3 Classification of Package
Code Package Name
C Die (Die Thickness 400µm)
CT Die (Thin Die: Old Die Thickness 260µm)
C-C Die (Thin Die: New Die Thickness 260µm)
C-D Die (Thin Die: Die Thickness 200µm)
C-L Die (Thin Die: Die Thickness 140µm)
E SOP8 JEDEC 150mil(EMP8)
F1 SOT-23-6-1
RB2 MSOP10 (TVSP10) *MEET JEDEC MO-187-DA / THIN TYPE
V SSOP8
W-H Wafer (Wafer Thickness 200µm)
W-L Wafer (Wafer Thickness 140µm)
Item 4 Taping Form
Symbol Packing Note
TE x Emboss carrier tape The taping form is shown by two or three-digit alphanumeric character in parentheses
1.6 LCD CONTROLLER DRIVER
Example1: NJU 6408B FG1 - 00
  1 2 3   4
Example2: NJU 6678A CL - G - CT3
  1 2 3   5   6
Item 1 Classification of items NJU----C-MOS IC Item 2 Part Number

The name of product is shown by four-digit number, and one or two capital alphabet (series product only).

Example: NJU6678A・NJU6678B

In case of substantial modification of circuit or masks, one capital alphabet is added to the name.

Example: NJU6408 →NJU6408B Item 3 Classification of Package (Refer to the 4.IC Package Code Table)
Item 4 ROM Version

The ROM version is shown by two-digit number after a hyphen.

Item 5 Chip Thickness

The Chip Thickness is shown by one capital alphabet after a hyphen.

Symbol Chip Thickness
No description 400µm
C 260µm
Z 625µm
G 675µm
Item 6 Tray Form

The Tray form is shown by two capital alphabet and one digit number after a hyphen.

Code Tray form Chip tray
CT1 One side tray 06-01
CT2 Both side tray 06-02
CT3 Both side tray 06-03
1.7 C-MOS,and Bip Others
Example: NJM 2370 U 05 (TE1)
  1 2 3 4 5
Item 1 Classification of items NJM----Bipolar monolithic IC ,NJU----C-MOS IC Item 2 Part Number The name of product is shown by four-digit number.
Item 3 Classification of Package(Refer to the 4.IC Package Code Table)

Output Voltage Accuracy
The output voltage accuracy is shown by one capital alphabet after package type mark.

Item 4 Output Voltage

The output voltage is shown by two-digit number.

Item 5 Taping form

The taping form is shown by two or three-digit alphanumeric character in parentheses.

2.GaAs IC
Example: NJG 1505 R (TE1)
  1 2 3 4
Item 1 Classification of items NJG----GaAs IC Item 2 Part Number

The name of product is shown by four-digit number. In case of substantial modification of circuit or masks, one capital alphabet is added to the name.

Item 3 Classification of Package (Refer to the 4. IC Package Code Table)
Item 4 Taping Form

The taping form is shown by two or three-digit alphanumeric character in parentheses.

3.OPTOELECTRONIC DEVICE
3.1 Optoelectronic Device
Example 1: NJL 5197 K -K F20 (TE1)
  1 2 3 4 5 6
Example 2: NJL 5181 K A -F10 (TE1)
  1 2 3 4 5 6
Item 1 Classification of items NJL----Optoelectronic Device Item 2 Part Number

The name of product is shown by four-digit number.

Item 3 Classification of Package
Item 4 Characteristics Selection

Specially selected product is shown by within two-digit capital alphabet after a hyphen.(Example 1)
But rank of output current is shown by within two-digit capital alphabet without hyphen.(Example 2)

Item 5 Lead Form

Special lead form is shown by only "F", or "F" with one or two digit-number after a hyphen.

Item 6 Taping Form

The taping form is shown by two or three-digit alphanumeric character in parentheses.

4.IC Package Code Table
The Codes are names defined in New JRC.
Code Package Name Note
C-x Chip "x": Thickness of Chip (One-Capital Alphabet)
Blank:400µm, G:675µm, Z:625µm, C:260µm, D:200µm, L:140µm, V:130µm
CL Bumped Chip (Bump Height: 15µm)  
CJ Bumped Chip (Bump Height: 17.5µm)  
CH Bumped Chip (Bump Height: 25µm)  
CU Bumped Chip (Bump Height: 45µm)  
CT Chip (with Spread Tape)  
Dx DIP "x": Mold Size (Blank or One-Digit Number)
DL TO-252(Forming Type, JEITA Type)  
DLx TO-252(Forming Type, JEDEC Type) "x": Lead Pitch or Material (Paste etc.) (Blank or One-Digit Number)
Ex SOP JEDEC 150 mil/ JEDEC 300 mil "x": Mold Size (Blank or One-Digit Number)
F TO-220F  
FL TO-220F Forming Type  
Fx SOT-23, SC-88A, SC-82AB "x": Lead Width (Blank or One-Digit Number)
FΔx QFP, LQFP, PLCC "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Length or Lead Pitch or Material (One-Digit Number)
GΔx SOP, HSOP "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch or Material (Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "G"
HΔx TAB "Δ": Circuit Pattern or Material (Two-Digit Number)
USB "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number or One-Capital Alphabet)
JΔx BCC, QFL "Δ": Package Type (One-Digit Number or One-Capital Alphabet)
"x": Package Specification (One-Digit Number)
KΔx FLP, DFN (SON, ESON), QFN "Δ": Mold Size (One-Digit Number or One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number)
1: 0.5mm Pitch
2: 0.65mm Pitch
3: 0.95mm Pitch
4: 0.4mm Pitch
L SDIP Lead Pitch 1.778mm
SIP8  
LΔx LCSP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch and Terminal Shape (One-Digit Number or One-Capital Alphabet)
Mx DMP, SDMP "x": Material (Blank or One-Digit Number)
MΔx EQFN "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
NΔx EPCSP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
PΔx FFP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (One-Digit Number)
RΔx MSOP (VSP, TVSP) "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch(Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "R"
SΔx
or
S□Δx
PCSP "□": Vendor Code
"Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch and Terminal Shape (One-digit Number or One-Capital Alphabet)
Blank TO-220F-3  
TΔx
or
TLΔx
TO-220 "L": Forming Type
"Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch (Blank or One-Digit Number)
Ux SOT-89 "x": Lead Pitch or Material (Paste etc.) (Blank or One-Digit Number)
UΔx EPFFP "Δ": Mold Size (One-Capital Alphabet)
"x": Lead Pitch or Package Thickness (One-Digit Number or One-Capital Alphabet)
VΔx SSOP, TSSOP "Δ": Mold Size (Blank or One-Capital Alphabet)
"x": Lead Pitch or Material (Blank or One-Digit Number)
However, the first package where the number of pins doesn't overlap is assumed to be "V"
W-x Wafer "x": Thickness of Wafer(One-Capital Alphabet)
C:260µm
J:260µm (BG Finishing Stone: #2000)
D:200µm
H:200µm (BG Finishing Stone: #2000)
L:140µm (BG Finishing Stone: #2000)
V:130µm (BG Finishing Stone: #2000)
The finishing stones are not specified in C,D
WH Wafer (with Bump)  
WS-x Scribed Wafer "x": Thickness of Wafer (One-Capital Alphabet)
WBΔx Scribed Wafer (with Bump) "Δ": Vendor Code and Material of bump (One-Capital Alphabet)
"x": Bump specification and Thickness of Wafer (One-Digit Number or One-Capital Alphabet)
WLΔx Bump Chip (Taping) "Δ": Vendor Code and Material of bump (One-Capital Alphabet)
"x": Bump specification and Thickness of Chip(One-Digit Number or One-Capital Alphabet)